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4 posts categorized "Silicon"

2010.04.08

New Single-Chip RFID Data Logger with Sensor Can Reduce Medical and Environmental Safety Concerns

WOLLERAU, Switzerland --(Business Wire)-- IDS Microchip, a fabless semiconductor company focused on all aspects of radio-frequency identification (RFID) technology, today began shipping development kits to early adopters for a first-of-its-kind RFID sensor and data logging chip, the IDS-SL900A. Based on the popular EPC Gen2 standard for supply chain applications, this new single-chip solution enables a vast new array of medical, food, healthcare and environmental-supervision applications that ensure quality and/or freshness. Like its high-frequency (HF) version, the IDS-SL13A introduced last year, it can automatically track, monitor, time-stamp and record temperature, pressure, humidity, light, sound and other information about any goods in supply chain or cold chain transport. However, unlike any other RFID solution, it also can be configured to notify users automatically of an event. This event-driven capability enables various applications in the cold chain, pharmaceutical, and food and health industries, as well as applications in the construction industry, and makes it possible to determine the conditions of materials used, in an economical, non-invasive and practical way. The IDS-SL900A’s sensor reading range of up to five or six meters is at least triple that of other data monitors/loggers. IDS Microchip will demonstrate the new IDS-SL900A at RFID Journal LIVE! 2010 in Orlando, Fla., Apr. 14-16, and at Euro ID 2010 in Cologne, Germany May 4-6, 2010.

Oluf Alminde, director of Sales & Marketing at IDS Microchip, said, “The new SL900A chip and sensor helps prevent the use of expired or faulty goods that could endanger people’s lives. For example, in medical and healthcare applications its automatic alarm can be set to warn users when freshness dates expire for food or pharmaceutical items such as insulin in the fridge, or for goods on store shelves. In terms of environmental safety, the SL900A sensor can be used to detect humidity in concrete instantly and effortlessly – replacing costly bridge closings, traffic reroutes, and jack-hammering, for example, with accurate assessment simply by driving across a bridge roadbed that has the chip embedded in it. The SL900A eliminates hassles and keeps people safer.”

For further information, visit www.ids-microchip.com.

2010.03.31

NEC Electronics America Enhances Microcontrollers for Industrial, Consumer Devices

SANTA CLARA, Calif. --(Business Wire)-- NEC Electronics America, Inc. announced it has expanded its robust 8-bit microcontroller (MCU) portfolio with the new All Flash™ 78K0/Kx2-A MCU series, featuring enhanced analog functionality for battery-operated portable devices. The four new MCUs offer robust peripherals combined with NEC Electronics’ proven 78K0 MCU interface and safety features to support applications that require high-precision analog sensing capabilities. Target applications include industrial building automation sensors and monitoring devices, and consumer electronics devices with human interface systems such as game-control handsets.

The new 78K0/Kx2-A series extends the rich analog peripheral set offered in NEC Electronics’ 78K0/Kx2 general-purpose MCUs and includes up to 12 channels of 12-bit analog-to-digital converters (ADCs), and 3-channel operational amplifiers (op-amps) interlocked with 12-bit ADC inputs.

To facilitate easy migration within the 78K0/Kx2 series, the new 78K0/Kx2-A MCUs also share many of the built-in features common to the 78K0 MCU family. The peripheral set includes UART, I2C and CSI/SPI serial interfaces, 8- and 16-bit timers to manage an array of real-time input and output events, clock generators, and a real-time counter with clock and calendar functions to maintain time-of-day clock without CPU intervention. The analog and serial interface integration helps to reduce system costs, while the optimized 8-bit circuit design helps designers achieve low power consumption and high performance levels similar to those associated with NEC Electronics’ other 78K0/Kx2 devices.

NEC Electronics America also provides a comprehensive suite of development tools to support the new 78K0/Kx2-A series. This includes software tools such as the CubeSuite™ integrated development environment, compiler, assembler, software debugger and code generator, as well as hardware tools such as NEC Electronics’ full-function IECube™ in-circuit emulator with real-time trace and MINICUBE2™ on-chip debug emulator and stand-alone flash programmer.

Pricing and Availability

The new 78K0/Kx2-A MCUs will be available in a 30-pin shrink-small outline package (SSOP) and 48-pin low-profile quad flat package (QFP) with flash memory capacities ranging from 16 to 32 kilobytes (KB). Samples are available now and distribution suggested resale pricing begins at $1.65 in volumes of 10,000 units. Mass production of the new devices is slated to begin in July 2010. (Pricing and availability are subject to change without notice.) More information about NEC Electronics America’s MCUs can be found at http://www.am.necel.com/micro/product/index.html.

*CubeSuite, IECube and NEC Electronics America are either registered trademarks or trademarks of NEC Electronics Corporation in the United States and/or other countries. NEC Electronics is a registered trademark or trademark of NEC Corporation. All other marks are property of their respective owners.

2010.03.17

Sprint and Axeda Announce Alliance for Global M2M Solutions

Alliance Provides Customers with Integrated Solution to Quickly Build and Deploy Connected Products

OVERLAND PARK, Kan. & FOXBORO, Mass. --(Business Wire)-- Mar 17, 2010 Embedded wireless broadband chips are expanding functionality across a vast range of devices beyond just mobile phones. Sprint (NYSE:S) and Axeda Corporation announced today an alliance to make it easier, faster and more cost-efficient for businesses to take machine-to-machine (M2M) solution ideas from concept to completion and deliver connected products using the Sprint 3G network and the Axeda® Platform.

Connected products such as e-readers, security devices, utility meters, and patient health monitors are already driving new business models and significant revenue streams across a variety of industries. According to ABI Research, it is predicted that revenue from these products in markets such as consumer, government, energy and utilities, and healthcare could grow 250% by the year 2013.

Sprint and Axeda help businesses take advantage of these opportunities by providing a highly secure, scalable and communication-optimized platform to build applications - allowing companies to focus on providing a business solution, not the enabling technology. Easy deployment through cloud-based services provide for faster time to market with no infrastructure costs.

“Over the last 12-months, we have seen a significant increase in enterprise-scale projects to create new products and services based on connected devices,” said Josh Holbrook, director, Yankee Group. “The challenge they face is managing the sheer volume of information coming from these devices - they need to build applications that make sense of this data and turn it into actionable information.”

For over a decade, Sprint has collaborated with customers and partners in a variety of industries to help develop deliver and support innovative M2M solutions. Sprint boasts that millions of embedded/M2M devices are running on the Sprint Network and partners benefit from the ability to certify devices on the Sprint Mobile Broadband Network through the company’s Open Device Initiative. For more information, visit www.poweryourideas.com/m2m.

“Partnering with Axeda enables Sprint to take advantage of the limitless business opportunities presented by connecting the rapidly expanding number of embedded and non-traditional mobile devices,” said Wayne Ward, vice president of Emerging Solutions, Sprint. “The Axeda Platform already powers some of the most advanced M2M applications on the market and our relationship will give our customers proven, enterprise-class technology with which to build critical business applications.”

Over 100 major organizations, including Abbott, EMC, Diebold, and NetApp rely on the Axeda Platform today to get value from their connected products. A Platform-as-a-Service (PaaS) solution, it reduces complexity and costs and provides key capabilities such as: condition monitoring, content management, location-based services, business rules, secure communication, and enterprise system integration that speed the creation of connected products.

“Our platform is built to manage hundreds of millions of interactions between products, people, and businesses on a daily basis,” said Dale Calder, president & CEO, Axeda. “Our alliance with Sprint allows for the cellular transmission of communications to be optimized for minimum cost to customers, while enabling them to take advantage of the reliability and speed of the Sprint 3G network.”

2010.03.10

Ericsson Wireless Unit Adopts Docea Power ACEplorer to Improve Power Choices

MOIRANS-GRENOBLE, France --(Business Wire)-- Mar 08, 2010 Docea Power, the Electronic System Level (ESL) company that delivers software for early power and thermal analysis, today announced that ST-Ericsson, a world leader in wireless platforms and semiconductors, has adopted and is deploying ACEplorer to improve architectural-level power choices for SoC (System-on-Chip) and platform design.

ACEplorer models and optimizes dynamic power and thermal behavior of whole electronics systems. It integrates a consistent power data management methodology for capturing and simulating power behavior. By separating the architecture from the applications, ACEplorer maximizes models reuse usable across teams and design flows from system level to silicon measurements.

“We are proud that ST-Ericsson adopted ACEplorer tool to tackle power and thermal options for its complex design projects,” said Ghislain Kaiser, co-founder and CEO of Docea Power. “It demonstrates the maturity of our solution for managing efficiently power and thermal issues in demanding sectors like the mobile industry.”

ACEplorer allows several design teams to work in parallel and succeed in formalizing a structured power aspect for every architect and designer. ACEplorer’s communications capabilities –such as reports and diagrams – allow design teams to communicate key results to project leaders and managers.

In less than a few minutes, ACEplorer can deliver precise simulation results for many scenarios and variants so that system designers and architects can choose with more confidence the best options for Intellectual Property (IP), hardware/software partitioning, cost and power consumption.

ACEplorer goes beyond the aspect of pure power. It can take into account information about bandwidth, frequency, CPU load and temperature which is becoming critical issue so design teams can easily find the best system dimensioning.

By separating power/thermal modelling from scenarios, ACEplorer allows design teams to easily reuse standalone models developed for previous projects. Models can be used as a documentation basis for the platform related power characteristics and concepts.

Docea Power is exhibiting at booth #52 at the Design, Automation & Test in Europe conference in Dresden, Germany, March 8 to 12 2010.

For more information: www.doceapower.com
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