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7 posts categorized "Design"

2010.04.12

Cinterion CEO says business is 'safe and sound’

Cinterion Wireless Modules' CEO Norbert Muhrer arrived in Las Vegas for International CTIA Wireless with a lot of momentum behind new business development efforts.

And yet, he also brought news for his clients and investors that the company's parent organization and financing source, Cinterion Holding, GmbH, had filed for bankruptcy and financial reorganization under the German courts.

We spoke with Muhrer last week, who shared more details about the logic behind the decision to file for protection. “The operational company is safe and sound,” he said, describing a new beginning for the company, and a new chapter in its history.

During a flurry of meetings at CTIA, Muhrer and Cinterion’s executive team told their customers and partners that under German law, insolvency is safeguarded such that “the holding insolvency has absolutely no impact on the operation of the company.”

Disbelief has accompanied the spreading news of the refinancing. During the last two years, once profitable brands have faced the grip of the recession. But it is unusual when the company continues to perform as the market leader.

Muhrer said it is suitable, from a certain perspective, to compare this reorganization to the home owner, who in the economic crisis, surveys his or her financial foundation and thinks, “This loan is too heavy. I can do better.”

After the filing in Munich on 22 March, the week of CTIA would continue with Cinterion news of automotive Land Grid Array (LGA) modules for process manufacturing, eToll, eCall, and fleet management.  From home base, Cinterion would also jointly announce with Telenor Connexion that week that they would pair HC25 modules and Telenor SIM cards for a new deployment with Hitachi Construction Machinery’s Global e-Service. Cinterion concurrently released sales data from 2009, confirmed by ABI Research, showing market growth and profits.

To provide deeper context, Muhrer highlighted the company’s history, since spun out of Siemens’ wireless manufacturing business two years ago.

“The company was founded in 2008 when there was no crisis on the market yet. And then the crisis happened,” he said. “We were lucky to the extent that we were small, we were fast, fast to implement changes and cost savings which would have been a difficult job if we were inside a huge conglomerate.”

This explains the success of the operating company, yet leaves questions as to the timing, and what else may be in the works.

Muhrer and the Cinterion executives confirmed there had been no change of ownership recently, but could not speak to market valuations or any potential change in ownership of the company.

Yet, the Financial Times German version (FTD) carried news last week that an offer had been made on former Siemens-owned wireless module company.

Citing an undisclosed source, FTD reported that Cinterion’s biggest creditor, Swedish fund EQT, made a bid to acquire the business. The offer was unsuccessful and prompted Cinterion’s owner, Hamburg-based private-equity firm Granville Baird GmbH, to announce that it would continue investing significant amounts for its own growth, according to FTD and Bloomberg News.

Muhrer estimated that ongoing work for the reorganization would culminate in May. “At the end of the financial restructuring process, we're going to have a lighter finance structure which will then be suitable to begin post-crisis business planning again.”

Parasoft Embedded Joins AUTOSAR

MONROVIA, Calif. --(Business Wire)-- Parasoft Embedded Corporation, leading provider of automated solutions that improve software quality and the development process for embedded systems, today announced its membership in the AUTOSAR Development Partnership.

Driven by the advent of innovative vehicle applications, contemporary automotive E/E architecture has reached a level of complexity which requires a technological breakthrough in order to manage it satisfactorily and fulfill heightened passenger and legal requirements. This need is particularly acute for high-end, luxury vehicle manufacturers and their leading Tier 1 suppliers who are faced with often conflicting requirements. Leading OEMs and Tier 1 suppliers, having recognized this to be an industry-wide challenge, decided to work together to address it, and created a development partnership called Automotive Open System Architecture (AUTOSAR).

For more information, visit www.autosar.org.

2010.03.31

CTIA-The Wireless Association® Announces Updated Best Practices for Location-Based Services

LAS VEGAS, NV – As International CTIA  Wireless exhibits concluded in Las Vegas last week, CTIA-The Wireless Association® announced the release of the industry’s updated voluntary “Best Practices and Guidelines for Location-Based Services” which promote and protect the privacy of wireless customers’ location information. Initially released in June 2008, the Guidelines were revised due to the dynamic and constantly innovative nature of the wireless ecosystem and the latest developments in Location-Based Services (LBS). 

“For more than a decade, CTIA has been a leader in ensuring consumers’ location privacy. As the wireless industry continues to develop innovative new devices, cutting-edge LBS apps and deploy next generation networks, it’s important that our industry’s best practices evolve to reflect the changes in the wireless ecosystem,” said Steve Largent, president and CEO of CTIA-The Wireless Association. 

In particular, the Guidelines have been revised to recognize that multiple entities can play a role in the delivery of a single LBS application. Updates to the Guidelines also address:

  • Application of the Guidelines to the use of various location technologies
  • Clarification of the relationship between account holder and user 
  • Other general improvements to aid clarity

LBS providers that have adopted these Guidelines provide consumers with the confidence and assurance that their private location information is protected.

For additional information about "Best Practices and Guidelines for Location-Based Services" and the Location Based Services Action Team, please visit: http://www.ctia.org/business_resources/wic/index.cfm/AID/11300.

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NEC Electronics America Enhances Microcontrollers for Industrial, Consumer Devices

SANTA CLARA, Calif. --(Business Wire)-- NEC Electronics America, Inc. announced it has expanded its robust 8-bit microcontroller (MCU) portfolio with the new All Flash™ 78K0/Kx2-A MCU series, featuring enhanced analog functionality for battery-operated portable devices. The four new MCUs offer robust peripherals combined with NEC Electronics’ proven 78K0 MCU interface and safety features to support applications that require high-precision analog sensing capabilities. Target applications include industrial building automation sensors and monitoring devices, and consumer electronics devices with human interface systems such as game-control handsets.

The new 78K0/Kx2-A series extends the rich analog peripheral set offered in NEC Electronics’ 78K0/Kx2 general-purpose MCUs and includes up to 12 channels of 12-bit analog-to-digital converters (ADCs), and 3-channel operational amplifiers (op-amps) interlocked with 12-bit ADC inputs.

To facilitate easy migration within the 78K0/Kx2 series, the new 78K0/Kx2-A MCUs also share many of the built-in features common to the 78K0 MCU family. The peripheral set includes UART, I2C and CSI/SPI serial interfaces, 8- and 16-bit timers to manage an array of real-time input and output events, clock generators, and a real-time counter with clock and calendar functions to maintain time-of-day clock without CPU intervention. The analog and serial interface integration helps to reduce system costs, while the optimized 8-bit circuit design helps designers achieve low power consumption and high performance levels similar to those associated with NEC Electronics’ other 78K0/Kx2 devices.

NEC Electronics America also provides a comprehensive suite of development tools to support the new 78K0/Kx2-A series. This includes software tools such as the CubeSuite™ integrated development environment, compiler, assembler, software debugger and code generator, as well as hardware tools such as NEC Electronics’ full-function IECube™ in-circuit emulator with real-time trace and MINICUBE2™ on-chip debug emulator and stand-alone flash programmer.

Pricing and Availability

The new 78K0/Kx2-A MCUs will be available in a 30-pin shrink-small outline package (SSOP) and 48-pin low-profile quad flat package (QFP) with flash memory capacities ranging from 16 to 32 kilobytes (KB). Samples are available now and distribution suggested resale pricing begins at $1.65 in volumes of 10,000 units. Mass production of the new devices is slated to begin in July 2010. (Pricing and availability are subject to change without notice.) More information about NEC Electronics America’s MCUs can be found at http://www.am.necel.com/micro/product/index.html.

*CubeSuite, IECube and NEC Electronics America are either registered trademarks or trademarks of NEC Electronics Corporation in the United States and/or other countries. NEC Electronics is a registered trademark or trademark of NEC Corporation. All other marks are property of their respective owners.

2010.03.24

Connected Development Partners with RFI Global to Streamline Approval and Certification

Design, testing and full certification for M2M devices now available from a single source.

Connected Development has announced their partnership with RFI Global Services, a leading technology test house with worldwide reach. As a result, companies developing new machine-to-machine (M2M) devices can enjoy end-to-end wireless product development, validation and complete certification for improved time to market and reduced costs.

Together, Connected Development and RFI can fully validate and certify products for operation anywhere in the world while providing dedicated expert support.

“We are pleased to partner with RFI Global for global certification services,” said Stefan Lindvall, President of Connected Development. “As a result, our customers can depend on proven M2M expertise, backed by global presence, first-class facilities and highly accredited testing services.”

“Our partnership with Connected Development will help our customers with the early-stage design and development support they need before they reach the certification stage of their projects,” said Stephen Kirk, Chief Executive of RFI Global Services. “In addition, we are looking forward to leveraging this relationship to further expand our presence and offerings in North America.”

In addition to certification provided in partnership with RFI Global Services, Connected Development is equipped to provide a variety of turnkey or a la carte validation services including: antenna and RF performance testing, design reliability testing, software quality and robustness testing, field testing,  custom use case development, and end-to-end project management.

Plus, Connected Development offers design and manufacturing services to take their customers all the way from concept to commercial. For more information about Connected Development, visit www.connecteddev.com or see us at CTIA Wireless 2010 in Las Vegas March 23-25, booth #257 in the M2M Zone.

Fusion Wireless to Introduce CDMA Platforms Based on Enfora Form Factors

RICHARDSON, Texas --(Business Wire)-- Mar 23, 2010 Enfora, a provider of intelligent wireless networking solutions, and Fusion Wireless, a provider of wireless platforms for the M2M and consumer markets, today announced that they have entered into an agreement allowing Fusion Wireless to provide embedded CDMA platforms in form factors that are compatible with embedded GSM/GPRS platforms from Enfora’s Enabler® product family.

As a result of this agreement, customers will have the flexibility to integrate GSM/GPRS and CDMA platforms that are pin-for-pin compatible. This can significantly reduce the cost and time of bringing wireless solutions to market across different countries with different wireless standards. The first samples of the compatible CDMA platforms are expected from Fusion Wireless in June 2010 with volume production by the end of the third quarter of 2010.

“Our collaboration with Fusion Wireless should minimize the engineering burden on OEMs and system integrators that wish to use both CDMA and GSM based solutions,” said Remy Marcotorchino, senior director of business development at Enfora. “We believe that customers will truly benefit from the choice of pin-for-pin compatible solutions from Fusion Wireless and Enfora, and we look forward to working with Enfora on satisfying the needs of value conscious customers,” added Dave Carey, President & CEO of Fusion Wireless.

For more information, visit www.enfora.com, www.fusionwirelesscorp.com.

2010.03.10

Ericsson Wireless Unit Adopts Docea Power ACEplorer to Improve Power Choices

MOIRANS-GRENOBLE, France --(Business Wire)-- Mar 08, 2010 Docea Power, the Electronic System Level (ESL) company that delivers software for early power and thermal analysis, today announced that ST-Ericsson, a world leader in wireless platforms and semiconductors, has adopted and is deploying ACEplorer to improve architectural-level power choices for SoC (System-on-Chip) and platform design.

ACEplorer models and optimizes dynamic power and thermal behavior of whole electronics systems. It integrates a consistent power data management methodology for capturing and simulating power behavior. By separating the architecture from the applications, ACEplorer maximizes models reuse usable across teams and design flows from system level to silicon measurements.

“We are proud that ST-Ericsson adopted ACEplorer tool to tackle power and thermal options for its complex design projects,” said Ghislain Kaiser, co-founder and CEO of Docea Power. “It demonstrates the maturity of our solution for managing efficiently power and thermal issues in demanding sectors like the mobile industry.”

ACEplorer allows several design teams to work in parallel and succeed in formalizing a structured power aspect for every architect and designer. ACEplorer’s communications capabilities –such as reports and diagrams – allow design teams to communicate key results to project leaders and managers.

In less than a few minutes, ACEplorer can deliver precise simulation results for many scenarios and variants so that system designers and architects can choose with more confidence the best options for Intellectual Property (IP), hardware/software partitioning, cost and power consumption.

ACEplorer goes beyond the aspect of pure power. It can take into account information about bandwidth, frequency, CPU load and temperature which is becoming critical issue so design teams can easily find the best system dimensioning.

By separating power/thermal modelling from scenarios, ACEplorer allows design teams to easily reuse standalone models developed for previous projects. Models can be used as a documentation basis for the platform related power characteristics and concepts.

Docea Power is exhibiting at booth #52 at the Design, Automation & Test in Europe conference in Dresden, Germany, March 8 to 12 2010.

For more information: www.doceapower.com
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