« Companies Provide Operators with an Interoperable, End-to-End Solution for over-the-Air Firmware Updating and Standards-Based Device Management | Main | Emergence of Mobile Health to Alleviate Key Health Care Industry Challenges, Finds CSMG Report »

2010.03.24

Cinterion Wireless Modules Adds Automotive LGA Technology Portfolio

LAS VEGAS – Cinterion Wireless Modules has announced its new AGS3  automotive module at CTIA Wireless 2010. The new module strengthens Cinterion’s market-leading M2M product portfolio, adding land grid array (LGA) technology to its automotive grade modules.

“We continue to push the M2M envelope, providing innovative modules for a broad range of budgets and applications worldwide,” said Norbert Muhrer, CEO and president, Cinterion Wireless Modules. “There’s tremendous opportunity and demand in the automotive sector and AGS3 with LGA mounting enables cost-effective, process manufacturing for eToll, eCall, fleet management and other large scale telematics applications.” 

Optimized for Automotive Plus LGA Innovation
AGS3, Cinterion’s sixth generation automotive module, is optimized for peak performance and rugged automotive application environments. It includes solderable LGA surface mounting technology for efficient, fully automated manufacturing and process consistency as well as advanced telematics features and functionality.

AGS3 meets the requirements of the European eCall initiative and is ideal for ITS applications such toll collect, telematics, fleet management and emergency call and roadside assistance solutions. It provides GPRS class 12 data speeds on 2G Quad-Band frequencies (850/900/1800/1900 MHz) for worldwide coverage. Other highlights of AGS3 include:

-       Cinterion LGA 119 form factor mounting
-       Full TCP/IP support (TCP, UDP, HTTP, FTP, SMTP, POP3)
-       Industrial Interfaces (USB, 2x serial, SPI, I2C)
-       RLS monitoring / jamming detection
-       Advanced temperature management, operating range: -40°C to +85°C
-       Latest processor technology: ARM9, 65nm
-       Antenna diagnostics as manufacturing support
-       SIM access profile
-       Automotive e-mark certificate
-       Prepared for European e-call initiative
 
For more information about Cinterion’s new AGS3 module, please visit booth #341 in the M2M Zone at CTIA Wireless 2010 in Las Vegas, March 23-25, or go to www.cinterion.com.

TrackBack

TrackBack URL for this entry:
http://www.typepad.com/services/trackback/6a0120a8cb47f8970b01310fd6afba970c

Listed below are links to weblogs that reference Cinterion Wireless Modules Adds Automotive LGA Technology Portfolio :

Comments

The comments to this entry are closed.

© 2010 Horizon House Publishing      BLOG HOME | NEWS | EVENTS | CONTACT | M2MZone.com